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Production Capabilities
Item Spec.
Product Category PCB & PCB HDI ELIC(5+2+5)
Max.Layer Count 2~32L
Board Thickness 0.5~5.0 OZ
線寬/線距 Core thckness:0.05mm-1.5mm Finished board thickness:0.3mm-3.5mm
Min.Hole Size Laser:0.075mm/3mil Mechnical:0.15mm/6mil
Min.Lind Width/Space 0.030mm/0.030mm(1.2mil/1.2mil)
Copper Thickness 1/3OZ-2OZ
Max.Panel Size 700mm*610mm
Registration Accuracy +/-0.05mm(2mil)
Routing Accuracy +/-0.075mm(3mil)
Min.BGA PAD 0.15mm(6mil)
Max.Aspect Ratio 10:1
Bow and Twist 0.50%
Impedance Control Tolerance +/-8%
Daily Output 3000m2
Surface Finishing ENIG/OSP/HASL/FINGER GOLD/IMMERSION TIN
Raw Material FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI